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CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor

    Buy cheap CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor from wholesalers
     
    Buy cheap CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor from wholesalers
    • Buy cheap CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor from wholesalers

    CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor

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    Brand Name : UNICOMP
    Model Number : CX3000
    Certification : CE, FDA
    Price : can negotiate
    Payment Terms : T/T,L/C
    Supply Ability : 30 sets per month
    Delivery Time : 30 days
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    CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor

    CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor


    X ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer.


    X ray Inspecting Features:


    (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.


    (2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.


    (3) The test preparation time is greatly reduced.


    (4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.


    (5) Double layers board and multi-layer boards only one check (with layered function).


    (6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.


    ItemDefinitionSpecs
    System ParametersSize750(L)x570(W)x890(H)mm
    Weight300kg
    Power220AC/50Hz
    Power Consumption0.5kW
    X-ray TubeTypeClosed
    Max.Voltage100kV
    Max.Power200μA
    Spot Size5μm
    DetectorIntensifierFPD
    X-ray Coverage48mm x 54mm
    Resolution208Lp/cm
    Work StationMax.Loading Size200mm x 200mm
    Max.Inspection Area200mm x 200mm
    Oblique Angle Views360° rotary fixture (Optional)
    X-ray Leakage<1μSv/h



    Quality CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED &amp; Semiconductor for sale
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