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Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis

Unicomp Technology
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    Buy cheap Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis from wholesalers
     
    Buy cheap Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis from wholesalers
    • Buy cheap Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis from wholesalers
    • Buy cheap Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis from wholesalers

    Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis

    Ask Lasest Price
    Brand Name : UNICOMP
    Model Number : AX8300MAX
    Certification : CE, FDA
    Price : can negotiate
    Payment Terms : T/T,L/C
    Supply Ability : 30 sets per month
    Delivery Time : 30 days
    • Product Details
    • Company Profile

    Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis

    Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX
    Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing.
    Applications
    This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components.
    Key Features
    • Professional semiconductor inspection configuration with 5 μm ultra-high resolution
    • Extended detection scope, supporting high-efficiency batch inspection and mass production testing
    • Dual rocker mechanical design, enabling flexible and precise manual operation
    • Compatible with 2D and 2.5D detection, with expandable 3D detection function
    • Dual-screen interactive design, supporting multi-task parallel operation and improving inspection efficiency
    • Integrated dedicated AI algorithm for automated semiconductor defect detection
    Technical Specifications
    Product NameAX8300MAX
    Dimension1286(W)*1540(D)*1700(H)[mm]
    Machine Weight1530kg
    Power Supply220V±10% 50Hz/60Hz 4A
    DetectorHigh resolution FPD
    Voltage110kV
    Power900w
    Tube TypeSealed
    Max. Power20W
    Detection Area129*129[mm]
    Pixel Matrix1536*1536[pixel]
    Frame RatesMax 30fps
    Geometric Magnification47.7X
    System Functions
    AX8300MAX X-ray inspection machine system functions and interface
    Inspection Sample Images
    Sample X-ray inspection images showing BGA solder joint analysis
    Frequently Asked Questions
    How about the package? Is it safe during delivery?
    All X-ray inspection machines are packed with standard wooden solid cartons. This ensures safe shipping and delivery.
    Do you provide warranty? How about the after-sales service?
    1-year warranty free for spare parts with lifetime technical support. We have a professional after-sales team and provide assistant videos for troubleshooting.
    If we come to your factory, will you provide free training?
    Yes, we warmly welcome you to visit our factory and will arrange comprehensive free training for your team.
    Our Services
    • Help customers analyze product projects and provide detection solutions
    • Provide professional detection solutions
    • Skilled jig design services
    • 24-hour feedback speed by email and other channels
    • Free sample detection testing
    • Provide shipping/delivery information checking service
    • One year guarantee with lifetime maintenance promise
    Quality Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis for sale
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